Applicable materials: silicon wafer, circuit chip, transparent key alloy steel, copper, coating metal, ABS, PVC, PES, organic polymer, etc. Applicable industry: used in depth, smoothness, fine precision requirements of various fields. Such as precision electronics and electricians, instruments and meters, hardware, glasses and clocks, IT industry, molds, solar photovoltaic products.
● 3D marking adopts pre-focusing optical mode, using large X and Y axis deflection lenses, so it can allow large laser spot conduction, good focusing accuracy and good energy effect; If 3D marking works with 2D marking at the same focusing precision, the marking range can be larger than 2D.
● 3D marking can quickly change the laser focal length and laser beam position, so the previous 2D can not achieve the surface marking becomes possible. After using 3D, the cylinder marking within a certain radian can be completed at one time, which improves the processing efficiency. Moreover, in real life, many parts of the surface shape is not regular, some parts of the surface height difference is quite large, for 2D marking processing is really powerless, at this time, 3D marking advantage will be more obvious than 2D.
● There are inherent defects in the traditional 2D marking of deep carving on the surface of the object. With the upward shift of the laser focus in the engraving process, the laser energy acting on the actual surface of the object will decrease sharply, which seriously affects the effect and efficiency of deep carving.
● For the traditional deep carving practice is electric way in the process of carving every certain time will lift platform to move a certain height to ensure that the laser surface focusing. 3D marking for deep carving processing, there is no such problem, not only to ensure the effect, but also improve the efficiency, while eliminating the cost of electric lifting platform.
● In the same plane, can achieve black and white, and even multi-color marking. For the general metal surface blackening, such as anodic alumina practice, usually in the appropriate energy to use a higher frequency pulse, in a certain defocus of the case of marking, defocus distance significantly affects the laser energy distribution and color effect on the material surface. For general 2D marking users, even without surface marking and other characteristics, 3D marking function for multi-gray multi-color effect of plane processing is also very meaningful.
Applicable materials: silicon wafer, circuit chip, transparent key alloy steel, copper, coating metal, ABS, PVC, PES, organic polymer, etc.
Applicable industry: used in depth, smoothness, fine precision requirements of various fields. Such as precision electronics and electricians, instruments and meters, hardware, glasses and clocks, IT industry, molds, solar photovoltaic products.
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