Suitable for microelectronics packaging and assembly has been used for high-density lead surface mount device reflow welding, thermal sensitive and electrostatic sensitive device reflow welding, selective reflow welding, BGA external lead convex production, Flip chip convex production, BGA convex repair, TAB device packaging lead connection, etc.
Planck Laser Technology is based on customer needs and pain points, providing pre-sales solution design for customers. The company has various process development and research equipment, actively cooperating with customers to carry out various process verifications, and combining Planck Laser's own technology to achieve intelligent unmanned production conditions for laser welding, laser cutting, laser cleaning, laser marking, etc. At the same time, product consistency and quality are guaranteed.
No. 7, 1st Road, Dongdu Industrial Park, Longshan
400-888-7769
86-0574-55122191/55122196
plancklaser@163.com
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