Suitable for microelectronics packaging and assembly has been used for high-density lead surface mount device reflow welding, thermal sensitive and electrostatic sensitive device reflow welding, selective reflow welding, BGA external lead convex production, Flip chip convex production, BGA convex repair, TAB device packaging lead connection, etc.
No. 7, 1st Road, Dongdu Industrial Park, Longshan
400-888-7769
86-0574-55122191/55122196
plancklaser@163.com
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